Samsung Announces New Logic Line for Mobile Application Processors

 

To meet the growing demands for logic products, Samsung have announced that it is planning to a build a new fabrication line in Hwaseong, South Korea. Samsung will invest 2.25 trillion Korean Won in the new fabrication line, which will break ground this month with an estimated completion by the end of 2013.

This new fabrication line will mainly produce highly advanced mobile application processors on 300mm wafers at 20nm and 14nm process nodes. Along with Line 9 and Lines 14, which have been converted to System LSI fabrication earlier this year, the new line will help supply the ever expanding need for smart mobile solutions.

With the new investments, plus the addition of Line 16 in Hwaseong last September and plans to build a new NAND Flash plant in Xi’an, China, Samsung looks to balance its global semiconductor fabrication prowess.

“With the construction of our new System LSI fabrication line, Samsung will be able to respond to the demand of the global IT industry and strengthen our ability to support our customers’ requirements even further,” said Stephen Woo, President of Samsung Electronics’ System LSI Business.

In other related news, according to market research conducted by Gartner, the demand for system semiconductor chips for use in smartphones and tablets will grow more than 20% on average from $23.4 billion in 2011 to $59.4 billion in 2016.

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